The IFA or Internationale Funkausstellung Berlin (International radio exhibition Berlin, a.k.a. 'Berlin Radio Show') is one of the oldest industrial exhibitions in Germany. Between 1924 and 1939 it was an annual event, but as from 1950 it was organized on a two yearly basis until 2005. Since then it has become an annual event again, held in September. Today it is one of world's leading trade shows for consumer electronics and home appliances.
IFA is the leading showcase for the global technology industry, hosting more innovation and product launches than any other event. It also presents more digital lifestyle products in one place than any other show worldwide.
IFA in Berlin presents the latest products and innovations in the heart of Europe‘s most important regional market. Only IFA offers such a comprehensive overview of the international market and attracts the attention of trade visitors each year from more than 100 countries. As of 2015 IFA is “Europe’s biggest tech show”. 245,000 visitors and 1,645 exhibitors attended IFA 2015.
This year at the IFA 2018 one of the main participants was the company HUAWEI. As always, HUAWEI impressed everyone with its innovative technologies of the future. HUAWEI is developing the technology of the future today.
HUAWEI launches Kirin 980, the world’s first commercial 7nm SoC
BERLIN, Germany—August 31, 2018—In his IFA 2018 keynote titled “The Ultimate Power of Mobile AI”, HUAWEI Consumer Business Group CEO Mr. Richard Yu introduced the Kirin 980, the system on a chip (SoC) that will bring about the next evolution of mobile AI. As the world’s first commercial SoC manufactured with Taiwan Semiconductor Manufacturer Company’s (TSMC) 7nm process, Kirin 980 combines best-in-class performance, efficiency, connectivity features, and Dual NPU AI processing power.
“Last year, we showed the world the potential of On-Device AI with the Kirin 970, and this year, we’ve designed an all-round powerhouse that not only features outstanding AI capabilities, but also brings cutting-edge raw performance to consumers,” said Mr. Yu. “Equipped with all-new CPU, GPU and Dual NPU, the Kirin 980 is the ultimate engine to power next-generation productivity and entertainment applications.”
The cutting edge TSMC 7nm process technology enables Kirin 980 to pack 6.9 billion transistors within a 1cm2 die size, 1.6 times of the previous generation. Compared to the 10nm process, the 7nm process delivers 20 percent improved SoC performance and 40 percent improved SoC power efficiency.
The Kirin 980 is also the first SoC to embed Cortex-A76 based cores, which are 75 percent more powerful and 58 percent more efficient compared with their previous generation. The Kirin CPU subsystem uses an intelligent Flex-scheduling mechanism that creates a 3-level energy efficiency architecture consisting of two super-big cores based on Cortex-A76, two big cores based on Cortex-A76, and four little cores Cortex-A55.
In pursuit of the best smartphone photography experience, HUAWEI integrated its proprietary fourth-generation ISP into the SoC. In addition to a 46 percent increase in data throughput compared to its predecessor, the new ISP also provides better support for multi-camera configurations, as well as an all-new HDR color reproduction technology that can manipulate picture contrast to highlight objects on various parts of an image.
And all this is just a part of capabilities that the CPU Kirin 980.
The next-generation AI experience is around the corner. Stay tuned for the launch of the first Kirin 980-powered Mate Series device, which is scheduled to arrive in October*.
*The specifications of Kirin 980 does not represent the specifications of the phone using this chip. All data and benchmark results are based on internal testing. Results may vary in different environments.